Three-Dimensional Integration and Modeling. A Revolution in RF and Wireless Packaging John Hoon Lee, Jong Hoon Lee, Manos M. Tentzeris

This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF/Wireless packaging and multifunctional miniaturization. Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules. Это и многое другое вы найдете в книге Three-Dimensional Integration and Modeling. A Revolution in RF and Wireless Packaging (John Hoon Lee, Jong Hoon Lee, Manos M. Tentzeris)